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Crystallization-induced stress in phase change random access memory

  • M. H. Li
  • , J. M. Li
  • , L. P. Shi
  • , H. X. Yang
  • , T. C. Chong
  • , Y. Li
  • Agency for Science, Technology and Research, Singapore
  • National University of Singapore

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Switched phase change material in Phase Change Random Access Memory (PCRAM) is confined within a solid surrounding. As a result of mechanical properties and micro structure differences between the crystalline and the amorphous phases, strains and stresses are generated and may degrade the performance of PCRAM devices. This paper investigated the crystallization-induced stress in phase change Ge2Sb2Te5 (GST) nano film. The electric-thermal and thermo-mechanical simulation results show that the increases of both of the Young's modulus and Coefficient of Thermal Expansion (CTE) are responsible for the stress generation upon crystallization. The XRD studies correlate the strains and stresses with the lattice deformation in crystalline GST films.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium Proceedings - Nano- and Microscale Materials-Mechanical Properties and Behavior under Extreme Environments
PublisherMaterials Research Society
Pages113-118
Number of pages6
ISBN (Print)9781615673865
DOIs
StatePublished - 2008
Externally publishedYes
EventNano- and Microscale Materials-Mechanical Properties and Behavior under Extreme Environments - Boston, MA, United States
Duration: 1 Dec 20085 Dec 2008

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1137
ISSN (Print)0272-9172

Conference

ConferenceNano- and Microscale Materials-Mechanical Properties and Behavior under Extreme Environments
Country/TerritoryUnited States
CityBoston, MA
Period1/12/085/12/08

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