Frequency bandwidth estimation of to packaging techniques for laser modules

N. H. Zhu; Y. L. Wang; C. Qian; E. Y.B. Pun; P. S. Chung

doi:10.1007/s11082-004-8307-3

Frequency bandwidth estimation of to packaging techniques for laser modules

N. H. Zhu^*
, Y. L. Wang
, C. Qian
, E. Y.B. Pun
, P. S. Chung

^*Corresponding author for this work

CAS - Institute of Semiconductors
City University of Hong Kong

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

Two simple methods for estimating the potential modulation bandwidth of TO packaging technique are presented. The first method is based upon the comparison of the measured frequency responses of the laser diodes and the TO laser modules, and the second is from the equivalent circuit for the test fixture, the TO header, the submount and the bonding wire. It is shown that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of over 10.5 GHz, and the two proposed methods give similar results.

Original language	English
Pages (from-to)	903-913
Number of pages	11
Journal	Optical and Quantum Electronics
Volume	37
Issue number	10
DOIs	https://doi.org/10.1007/s11082-004-8307-3
State	Published - Aug 2005
Externally published	Yes

Keywords

Laser module
Optical modulation
Packaging
Scattering parameter measurement
Semiconductor laser

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10.1007/s11082-004-8307-3

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@article{1b0defe304714ff482f2212d2d60ce60,

title = "Frequency bandwidth estimation of to packaging techniques for laser modules",

abstract = "Two simple methods for estimating the potential modulation bandwidth of TO packaging technique are presented. The first method is based upon the comparison of the measured frequency responses of the laser diodes and the TO laser modules, and the second is from the equivalent circuit for the test fixture, the TO header, the submount and the bonding wire. It is shown that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of over 10.5 GHz, and the two proposed methods give similar results.",

keywords = "Laser module, Optical modulation, Packaging, Scattering parameter measurement, Semiconductor laser",

author = "Zhu, \{N. H.\} and Wang, \{Y. L.\} and C. Qian and Pun, \{E. Y.B.\} and Chung, \{P. S.\}",

year = "2005",

month = aug,

doi = "10.1007/s11082-004-8307-3",

language = "英语",

volume = "37",

pages = "903--913",

journal = "Optical and Quantum Electronics",

issn = "0306-8919",

publisher = "Springer",

number = "10",

}

TY - JOUR

T1 - Frequency bandwidth estimation of to packaging techniques for laser modules

AU - Zhu, N. H.

AU - Wang, Y. L.

AU - Qian, C.

AU - Pun, E. Y.B.

AU - Chung, P. S.

PY - 2005/8

Y1 - 2005/8

N2 - Two simple methods for estimating the potential modulation bandwidth of TO packaging technique are presented. The first method is based upon the comparison of the measured frequency responses of the laser diodes and the TO laser modules, and the second is from the equivalent circuit for the test fixture, the TO header, the submount and the bonding wire. It is shown that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of over 10.5 GHz, and the two proposed methods give similar results.

AB - Two simple methods for estimating the potential modulation bandwidth of TO packaging technique are presented. The first method is based upon the comparison of the measured frequency responses of the laser diodes and the TO laser modules, and the second is from the equivalent circuit for the test fixture, the TO header, the submount and the bonding wire. It is shown that the TO packaging techniques used in the experiments can potentially achieve a frequency bandwidth of over 10.5 GHz, and the two proposed methods give similar results.

KW - Laser module

KW - Optical modulation

KW - Packaging

KW - Scattering parameter measurement

KW - Semiconductor laser

UR - https://www.scopus.com/pages/publications/25144518725

U2 - 10.1007/s11082-004-8307-3

DO - 10.1007/s11082-004-8307-3

M3 - 文章

AN - SCOPUS:25144518725

SN - 0306-8919

VL - 37

SP - 903

EP - 913

JO - Optical and Quantum Electronics

JF - Optical and Quantum Electronics

IS - 10

ER -

Frequency bandwidth estimation of to packaging techniques for laser modules

Abstract

Keywords

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