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Microwave packaging of high-speed semiconductor lasers

  • N. H. Zhu
  • , S. J. Zhang
  • , C. Chen
  • , Y. Liu
  • , C. Liu
  • , E. Y.B. Pun
  • , P. S. Chung
  • CAS - Institute of Semiconductors
  • City University of Hong Kong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Many new and different packaging types of high-speed semiconductor lasers have been developed to meet the rapidly increasing demand. This paper describes the recent progress in the microwave issues of high-speed semiconductor laser packaging.

Original languageEnglish
Title of host publicationIntegrated Photonics Research and Applications, IPRA 2005
PublisherOptical Society of America (OSA)
ISBN (Print)1557527873, 9781557527875
DOIs
StatePublished - 2005
Externally publishedYes
EventIntegrated Photonics Research and Applications, IPRA 2005 - San Diego, CA, United States
Duration: 10 Apr 200510 Apr 2005

Publication series

NameOptics InfoBase Conference Papers
ISSN (Electronic)2162-2701

Conference

ConferenceIntegrated Photonics Research and Applications, IPRA 2005
Country/TerritoryUnited States
CitySan Diego, CA
Period10/04/0510/04/05

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