跳到主要导航 跳到搜索 跳到主要内容

Microwave packaging of high-speed semiconductor lasers

  • N. H. Zhu
  • , S. J. Zhang
  • , C. Chen
  • , Y. Liu
  • , C. Liu
  • , E. Y.B. Pun
  • , P. S. Chung
  • CAS - Institute of Semiconductors
  • City University of Hong Kong

科研成果: 书/报告/会议事项章节会议稿件同行评审

摘要

Many new and different packaging types of high-speed semiconductor lasers have been developed to meet the rapidly increasing demand. This paper describes the recent progress in the microwave issues of high-speed semiconductor laser packaging.

源语言英语
主期刊名Integrated Photonics Research and Applications, IPRA 2005
出版商Optical Society of America (OSA)
ISBN(印刷版)1557527873, 9781557527875
DOI
出版状态已出版 - 2005
已对外发布
活动Integrated Photonics Research and Applications, IPRA 2005 - San Diego, CA, 美国
期限: 10 4月 200510 4月 2005

出版系列

姓名Optics InfoBase Conference Papers
ISSN(电子版)2162-2701

会议

会议Integrated Photonics Research and Applications, IPRA 2005
国家/地区美国
San Diego, CA
时期10/04/0510/04/05

引用此