The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy

Chun Yee Aaron Ong; Daniel John Blackwood; Yi Li

doi:10.1016/j.surfcoat.2018.09.086

The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy

Chun Yee Aaron Ong^*
, Daniel John Blackwood
, Yi Li

^*此作品的通讯作者

National University of Singapore
CAS - Institute of Metal Research

科研成果: 期刊稿件 › 文章 › 同行评审

40 引用（Scopus）

摘要

Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with <13 at.% tungsten. A Hall-Petch trend with a critical grain size of 5 nm was observed, in line with expectations.

源语言	英语
页（从-至）	23-27
页数	5
期刊	Surface and Coatings Technology
卷	357
DOI	https://doi.org/10.1016/j.surfcoat.2018.09.086
出版状态	已出版 - 15 1月 2019
已对外发布	是

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title = "The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy",

abstract = "Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.\% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with <13 at.\% tungsten. A Hall-Petch trend with a critical grain size of 5 nm was observed, in line with expectations.",

keywords = "Electrodeposition, Hall-Petch effect, Nanocrystalline metal, Nickel alloys, Nickel-tungsten",

author = "Ong, \{Chun Yee Aaron\} and Blackwood, \{Daniel John\} and Yi Li",

note = "Publisher Copyright: {\textcopyright} 2018 Elsevier B.V.",

year = "2019",

month = jan,

day = "15",

doi = "10.1016/j.surfcoat.2018.09.086",

language = "英语",

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T1 - The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy

AU - Ong, Chun Yee Aaron

AU - Blackwood, Daniel John

AU - Li, Yi

PY - 2019/1/15

Y1 - 2019/1/15

N2 - Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with <13 at.% tungsten. A Hall-Petch trend with a critical grain size of 5 nm was observed, in line with expectations.

AB - Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25 nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with <13 at.% tungsten. A Hall-Petch trend with a critical grain size of 5 nm was observed, in line with expectations.

KW - Electrodeposition

KW - Hall-Petch effect

KW - Nanocrystalline metal

KW - Nickel alloys

KW - Nickel-tungsten

UR - https://www.scopus.com/pages/publications/85054467281

U2 - 10.1016/j.surfcoat.2018.09.086

DO - 10.1016/j.surfcoat.2018.09.086

M3 - 文章

AN - SCOPUS:85054467281

SN - 0257-8972

VL - 357

SP - 23

EP - 27

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

ER -

The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy

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